Description:

Aimed at applying their unique fabrication process to the development of integrated circuits, and microsystems, Ball's new fabrication approach is based on developing a 3-dimensional spherical lithography method and processing 1mm single crystal spheres using non-contact material processes.

The potential payoff of this work is a three-fold increase in available fabrication space, 90% fabrication cost reduction vs. conventional flat chip technology, and reduced fabrication time. The company is focusing on developing 5 technologies: single-crystal sphere fabrication, non-contact process methods, spherical lithographic techniques, design protocols, and assembly methods. The company has shown the ability to process and stack spheres to develop clusters as shown.

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