This paper briefly surveys recent developments in engineering physics approaches and self-assembly chemistry methodologies for creating 3-D photonic crystals and how this has led to in-wafer patterned colloidal crystals. These materials are comprised of single crystal micrometer scale features of silica colloidal crystals that have controlled thickness, area and orientation and are embedded within a single crystal silicon wafer.

Opal-patterned chips may provide an enabling technology for engineering photonic crystal lattices, photonic band structures and defects in 3-D photonic crystals that have stop bands or complete photonic band gaps operating at visible or near infrared wavelengths. These advances in 3-D photonic crystals if reduced to practice could pave the way to an coupling of photonic crystal devices with optical fibers on chips for future photonic integrated circuits, computer and telecommunication systems.
 

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