
www.nanopicoftheday.org
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April 8, 2004
Source: Hou Tee Ng
References:
Description:
Interfacing semiconducting nanostructures with conducting or insulating
substrates to attain a three-dimensional (3D) integrated platform is highly
desirable for advanced nanoscale electronics and optoelectronics applications.
As such, the assembly and synthesis of these nanostructures, which demonstrate
multiple dimensionality, using a bottom-up approach would be useful. In
this example, 1D ZnO nanowires about 80nm in diameter grow vertically out of the
junctions of 80nm thick ZnO nanowalls.
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