M. Uhlemann, A. Gebert, M. Herrich, A. Krause, A. Cziraki, L. Schultz. Electrochemical deposition and modification of CU/Co-Cu multilayer, Electrochimica Acta 48 (2003) Nr. 20-22, S. 3005-3011

A. Cziraki, M. Koeteles, L. Peter, Z. Kupay, J. Padar, L. Pogany, I. Bakonyi, M. Uhlemann, M. Herrich, B. Arnold, J. Thomas, H.D. Bauer, K. Wetzig. Correlation between interface structure and giant magnetoresistance in electrodeposited Co-Cu/Cu multilayers, Thin Solid Films 433 (2003) Nr. 1-2, S. 237-242.

Description:

Magnetic multilayers are composed of an alternating sequence of nonmagnetic and magnetic thin layers of only some nanometer thickness. TEM (Transmission Electron Microscopy) was used to image the few nanometer thick layers of copper and cobalt in the above image.  In the last decade, these multilayer systems have gained importance in magnetic sensor technology and magnetoelectronics due to their giant magnetic resistance (GMR) properties. Usually magnetic thin films and multilayer systems are prepared by means of physical deposition techniques. The method of electrodeposition (which was used to deposit the thin film imaged above) offers a very cost efficient and fast way to grow ultrathin films on large area substrates.


 

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